2014年发表

1、Chong Liu, Lei Wang, Jing-min Li（通讯）,, Meng Li, Yajie Duan, Tao Li, Lu Gan. Evaporation characteristics of micropores in biomimetic micropump,  Micro & Nano Letters, 2014, 9(1), 41–45. 
 
2、X. D. Wang, L. F. Zhang, M. Z. Xin, Y. Q. Qu, Y. Luo, T. M. Ma, L. Chen, The precision measurement and assembly for miniature parts based on double machine vision systems (invited), Ninth International Symposium on Precision Engineering Measurement and Instrumentation, Proc. of SPIE Vol. 9446, 944655   

3、Xiaodong Wang, Yongzhen Chi, Yi Luo, Xiwen Zhang, An Exchangeable Gripper Module Integrated in the Assembly System for Multi Miniature Parts, IEEE Int. Conf. on Information and Automation, 2014

4、Liu Junshan, Song Dongfang, Zong Guoge, Yin Penghe, Zhang Xiaolei, Xu Zheng, Du Liqun, Liu Chong, Wang Liding. Fabrication of SU-8 moulds on glass substrates by using a common thin negative photoresist as an adhesive layer. Journal of Micromechanics and Microengineering, 2014, 24: 035009.

5、D. Wang*, E. Filoux, F. Levassort, M. Lethiecq, S.A. Rocks, R.A. Dorey,‘Fabrication and characterization of annular-array, high-frequency,ultrasonic transducers based on PZT thick film’, Sensors and Actuators A: Physical, 2014, 216, 207-213. (SCI/EI)

6、D. Wang*, Y. Li, J. Liang, Z. Xia, S. Wang, C. Liu, G. Sun, X. Wang,‘Fabrication and performance of different structural cathode catalyst layers by EHDA deposition for DMFC’, Fuel Cells, 2014, 14, 277-283. (SCI/EI)

7、D. Wang*, Q. Ma, J. Liang, F. Xue, L. Chen, X. Wang, X. Zhou, Z. Liu,‘Patterning of graphene microscale structures using electrohydrodynamic atomization deposition of photoresist moulds’, Micro & Nano Letters, 2014, 9, 136–140. (SCI/EI) 

8、D. Wang, F. Zhang, J. Liang*, H. Zhang, C. Liu, W. Zhou, L. Li, T. Ren, T. Wang, ‘Temperature Drifts Compensation of Strain-temperature Method for the Measurement of Continuous Welded Rail Temperature Force’, Applied Mechanics and Materials, 2014, 541-542, 1370-1375. (EI)

9、 Xu Zheng, Li Yongkui, Wang Jun-yao, etal.A Novel Method for Fabricating Micro-Nano fluidic Devices and Its Application to Trace Enrichment，Chinese Journal of Analytical Chemistry, 2014,42(2), p 166-172，SCI（封面文章）

10、J. Liang*, D. Li, D. Wang, K. Liu, L. Chen, ‘Preparation of stable superhydrophobic film on stainless steel substrate by a combined approach using electrodeposition and fluorinated modification’, Applied Surface Science, 2014, 293, 265-270. (SCI/EI)

11、Ren Tongqun, He Liang, Hui Meiling, Zhang Zhiyong, The quaterninon transmissibility’, 7th International Congress on Image and Signal Processing, CISP 2014, p 1156~1161(EI 检索)

12、凌四营，王立鼎，娄志峰，柳强，翟仁文，超精密齿距偏差测量中测点位置的误差补偿[J]. 仪器仪表学报. 2014，35(03)：691-696. (EI)

13、LING Siying， LOU Zhifeng， LIU Qiang，WANG Liding. The periodical translocation gear-grinding technique to improve the indexing accuracy of ultra-precision gears. Advanced Materials Research Vols. 941-944 (2014) pp 2134-2139.(EI)

14、Siying Ling，Bing Zhang，Jun Zhang and LidingWang. Two gear-grinding techniques to improve pitch deviations of ultra-precision gears. IMechE Part B: J. Engineering Manufacture，published online 18 August 2014, DOI: 10.1177/0954405414544532.(SCI)

15、Wang Jun-yao, Liu Chong, Xu Zheng*, etal.Ion-enrichment and ion-depletion of nanochannels based on electrochemical potential in a micro-nanofluidic chip，Microsystem Technologies, 2014, 20(1), p 35-39，SCI

16、Zhang,Xiaolei, Du Liqun, Zhao Ming. Quantitative Investigation of the Adhesion Strength Between an SU-8 Photoresist and a Metal Substrate by Scratch Tests. JOURNAL OF APPLIED POLYMER SCIENCE, 131(24-SL), 411081-411089, DEC 15 2014. (SCI, EI检索)

17、Shao, Ligeng, Du, Liqun, Wang, Liding. Enhancing the adhesion strength between Cu substrate and Ni layer in microelectroforming. Materials and Manufacturing Processes, v 29, n 7, p 795-800, July 3, 2014. (SCI, EI检索)

18、Ligeng Shao, Liqun Du, Chong Liu, Liding Wang. Microstructure and mechanical properties of nanocrystalline nickel prepared by pulse reverse microelectroforming. Journal of Experimental Nanoscience, v 9, n 3, p 299-309, 2014. (SCI, EI检索)

19、Xi Zhanwen, Zhang Ping, Nie Weirong, Du Liqun, Cao   Yun. A novel MEMS omnidirectional inertial switch with flexible electrodes. Sensors and Actuators A: Physical, v 212, p 93-101, June 1, 2014. (SCI, EI检索)

20、 Zhong Zhao ; Liqun Du ; Zhicheng Tan.  Influence of electrodeposited crystallite size on interfacial adhesion strength of electroformed layer. Micro & Nano Letters,  9(2), p. 73 – 76. February 2014. (SCI, EI检索)

21、Zhang Beibei, Li Yinbao, He Qidi, Qin Jun, Yu Yanyan, Li Xinchun Zhang Lin, Yao Meicun, Liu Junshan, Chen Zuanguang. Microfluidic platform integrated with worm-counting setup for assessing manganese toxicity. Biomicrofluidics, 2014, 8: 054110.

22、Lei Wang, Chong Liu, Jing-min Li （通讯）, Zheng Xu. External-integrated biomimetic micropump for microfluidic system, J. Micro/Nanolith. MEMS MOEMS, 2014, 13(3), 033008.

2015年发表

1、Du, Liqun, Zhao, Ming; Wang, Aoan; Chen, Shengli; Nie, Weirong. Fabrication of novel MEMS inertial switch with six layers on a metal substrate. Microsystem Technologies, v 21, n 9, p 2025-2032, September 21, 2015 .(SCI, EI检索)

2、Liu Junshan, Wang Liang, Ouyang Wei, Wang Wei, Qin Jun, Xu Zheng, Xu Shenbo, Ge Dan, Wang Longchang, Liu Chong, Wang Liding. Fabrication of PMMA nanofluidic electrochemical chips with integrated microelectrodes. Biosensors and Bioelectronics, 2015, 72: 288-293.
 
3、Dazhi Wang, Wen Zha, Xiaohu Zhu, Yang Li, Junsheng Liang, Tongqun Ren*, Yi Luo, Xiaodong Wang and Chong Liu, ‘Electrohydrodynamic atomization deposition of fuel cell catalyst-coated membrane with structure and material gradient variation’, Key Engineering Materials, 2015, 645-646, 1156-1162. (EI)

4、Dazhi Wang, Xiaohu Zhu, Wen Zha, Tongqun Ren*, Mingqiang Li, Junsheng Liang and Chong Liu, ‘Formation of membrane electrode assembly for high temperature methanol fuel cells’, Key Engineering Materials, 2015, 645-646, 1175-1180. (EI)

5、D. Wang, X. Zhu, J. Liang*, T. Ren, W. Zha, W. Dong, S.A. Rocks, R.A. Dorey, Z. Xua and X. Wang, ‘Electrohydrodynamic jet printing of PZT thick film micro-scale structures’, Journal of the European Ceramic Society, 2015, 35, 3475-3483. (SCI/EI，JCR一区)

6、Xu Zheng, Lv Zhi-bin, Wang Lin-gang, etal.Research on impact behaviour and silicon insert fracture phenomenon in microinjection moulding, AIP Advances，2015, 5, 041317

7、Xu Zheng, Hu Shuai-long, Tian Wei-fang,Cyclic Voltammetric Determination of Glutamic-pyruvic transaminase Activity based on the transdeamination，Analytical Methods, 2015, DOI: 10.1039/C5AY01794G（封面）

8、Xu Zheng, Lv Zhibin, Wang Lingang, Jiang Kaiyu, Ji Zhi, Liu Chong, Liu Junshan. Research on impact behavior and silicon insert fracture phenomenon in microinjection moulding. AIP Advances, 2015, 5: 041317.

9、Xu Zheng, Lu JiaQing , Hu ShuaiLong, etal.,Impedance monitoring of droplets in a microfluidic Chip, Micro and Nanosystems, 2015,7(1), p 60-63(EI)

10、J. S. Liang*, Y. Zhang, D. Z. Wang*, T. P. Luo, and T. Q. Ren, ‘A novel compact heat exchanger using gap flow mechanism’, Review of Scientific Instruments, 2015, 86, 024904. (SCI/EI)

11、Junsheng Liang*, Kuanyao Liu, Shouzuo Li, Dazhi Wang*, Tongqun Ren, Xiaoying Xu, Ying Luo, ‘Novel Flow Field with Superhydrophobic Gas Channels Prepared by One-step Solvent-induced Crystallization for Micro Direct Methanol Fuel Cell’, Nano-Micro Letter, 2015, 7(2), 165–171. (SCI)

12、Liang Junsheng*, Liu Kuanyao, Wang Dazhi*, Li Hao, Li, Pengfei, Li Shouzuo,Su Shijie, Xu Shuangchao, Luo Ying, ‘Facile fabrication of superhydrophilic/superhydrophobic surface on titanium substrate by single-step anodization and fluorination’, Applied Surface Science, 2015, 338, 126-136, (SCI/EI)

13、Ren Tongqun*, Hui Meiling, Liang Junsheng, Wang Dazhi, He Liang, Chen Yonghang,‘Structural state detection using transmissibility and Non- negative Matrix Factorization’, International Journal of Signal Processing, Image Processing and Pattern Recognition, 2015, 8 (11), 309-318. (EI)

14、Tongqun Ren, Liang He, Dazhi Wang*, Junsheng Liang, Meiling Hui, ‘Structural state detection using quaternion-based three-channel joint transmissibility’, Journal of Vibroengineering, 2015, 17, 928-938. (SCI/EI)

15、Tongqun Ren* and Dazhi Wang,‘Self-adaptive 3D pairwise view registration by surface fitting and hill-climbing method’, IEEJ Transactions on Electrical and Electronic Engineering, 2015, 10, 350-352. (SCI) 

16、Zhao, Zhong, Du, Liqun. Quantitative relationship between crystallite size and adhesion strength of the electroforming layer during microelectroforming process.Micro and Nano Letters,v 10, n 2,p 64-66,February 1, 2015. (SCI, EI检索)

17、Feng, Zhihua, Shao, Ligeng, Du, Liqun, Wang, Liding. Threefold diffusion layer model for one kind of pulse reverse nanoelectroforming. Journal of Computational and Theoretical Nanoscience, v 12, n 9, p 2259-2263, September 2015. (SCI, EI检索)

18、Congming Li, Yi Luo, Chuanpeng Zhou, Qing Shan and Xiaodong Wang, Charging method of micro heat pipe for high-power LED, Micro & Nano Letters, doi: 10.1049/mnl.2015.0097

19、Wang Ke, Liu Chong, Wang Dazhi*, Liang Junsheng, Ren Tongqun, Zhang, Lihua and Li Liang,‘Investigation of continuously welded rail of ballastless longitudinal stress distribution of rail break journal of testing and evaluation’, Journal of Testing and Evaluation, 2015, 43, 5. (SCI/EI)

2016年发表

1、Du Liqun, Yang Tong, Zhao Ming. Study on Improving Thickness Uniformity of Microfluidic Chip Mold in the Electroforming Process. MICROMACHINES, v 7, n 1, p 1-12, JAN. 2016. (SCI, EI检索)

2、Dazhi Wang, Wen Zha, Li Feng, Qian Ma, Xianming Liu*, Ning Yang, Zheng Xu, Xiaojun Zhao, Junsheng Liang*, Tongqun Ren and Xiaodong Wang, ‘Electrohydrodynamic jet printing and preliminary electrochemistry test of graphene micro-scale electrodes’, Journal of Micromechanics and Microengineering, 2016, 26, 045010. (SCI/EI)

3、Xu Zheng, Jun-yao Wang, Shuai-long Hu, etal. Electrokinetic concentrating with a nanofluidic device for magnetic beads-based antigen–antibody immunoassay，Microsystem Technologies, 2016,22(2), p 283-286.SCI

4、Junsheng Liang*, Pengfei Li, Dazhi Wang, Xu Fang, Jiahong Ding, Junxiong Wu, Chang Tang,‘Fabrication of Crack-free Barium Titanate Thin Film with High Dielectric Constant Using Sub-Micrometric Scale Layer-by-Layer E-Jet Deposition’, Materials, 2016, 9, 16. (SCI/EI)

5、Zhao, Zhong, Du, Liqun, Xu, Zheng, Shao, Ligeng. Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu substrate. Ultrasonics Sonochemistry, v 29, p 1-10, March 3, 2016 (SCI, EI检索，影响因子：4.321，1区)

6、Zhong Zhao, Liqun Du , Yousheng Tao , Qingfeng Li , Lei Luo. Enhancing the adhesion strength of micro electroforming layer by ultrasonic agitation method and the application. Ultrasonics Sonochemistry, v 33, p 10-17, 2016. (online，SCI, EI检索期刊，影响因子：4.321，1区)

7、Yin, Zhifu, Liping Qi, Helin Zou and Lei Sun. "A Novel 2d Silicon Nano-Mold Fabrication Technique for Linear Nanochannels over a 4 Inch Diameter Substrate." Scientific Reports 6, (2016).